Editing Applications of Edge Computing (section)

===8.3.3 Harsh Environments===
This section further builds upon the environmental challenges discussed in section 8.1.3. Edge Computing particularly amplifies these challenges due to thermal, mechanical, and operational constraints. 

* '''Thermal Management in AUVs'''
: Edge processors generate 5–50W of heat in sealed AUV hulls, creating thermal gradients that directly affect the lifespan of components.

{| class="wikitable" style="margin:auto"
|+ Comparative Analysis
|-
! Parameter !! Impact 
|-
| Heat Density || 10–100x higher than passive systems
|-
| Heat Dissipation Rate || 80% slower than air-cooled designs
|-
| Temperature Fluctuations || ±20°C during compute bursts
|}


:This can be handled using Phase Change Materials (PCM) such as paraffin wax to absorb the heat during heavy computation. One other common method of handling excess heat is through liquid cooling loop where a dielectric fluid circulates through titanium channels. There's also the method of Thermoelectric Harvesting which converts waste heat and powers low-energy sensors with it.
::> Case Study: WHOI’s Orpheus AUV limits hull temperatures to 55°C at 6,000m depth.

*'''Pressure-Induced Component Degradation'''
: High-density edge electronics face accelerated failure under extreme hydrostatic pressure (capacitors face capacitance loss, solder joints get microfractures, etc.). This can be prevented using oil-filled pressure cavities and using solid-state tantalum designs.

* '''Corrosion & Biofouling'''
: Unprotected copper circuits get corroded 50% faster in deep-sea as compared to the surface. To reduce this effect graphene coatings are used. And to counter biofouling, UV-LED antifouling with 5W arrays are used to inhibit microbial growth on sensors.

: Edge-enabled AUVs suffer severely from a phenomenon known as Galvanic Corrosion. Most AUVs contain unprotected multi-metal (copper, iron, nickel) circuit boards that get corroded 50% faster in deep-sea as compared to the surface. Another major problem is the formation of natural Microbial Fuel Cells (MFC) on electrical components caused by microorganisms. This can lead to electron transfers and short circuits. Seawater also gets trapped in dense component arrays and causes crevice corrosion. To tackle all of these problems, there are some advanced protection methods. 
:: 1. Graphene Nanocoatings reduce corrosion current by almost 89% (MIT Sea Grant trials) and add protective layers (<1μm in thickness) to PCBs.
:: 2. UV-LED Antifouling is a process where 5W 365nm arrays are used to inhibit microbial growth while consuming only 0.3% of the system’s energy budget. 
:: 3. Self-Healing Epoxy resins are used to extend component lifespans threefold in saline environments by releasing corrosion inhibitors when damage occurs.

Edge computing introduces critical thermal/mechanical challenges that require co-design of hardware and marine platforms. All of these techniques aim to enhance the durability of edge systems in harsh underwater conditions while maintaining operational efficiency. The optimal balance occurs at 2,000–4,000m depths using hybrid cooling strategies.